Monitor hydraulic, pneumatic, vacuum, water, and welding gas pressures in robot automation.

Having a worldwide automotive team with over 80 dedicated people helps our customers manage global projects and minimize risk. We use our ability to coordinate between OEM or tier headquarters, machinery builders and end-user plant locations to ensure our customers have the lowest possible life-cycle costs and minimize their risks.

What is Distributed Modular I/O?
Think of a remote “slice” I/O solution. In a typical application, the communication head and the power supply sit on the left hand side and are followed along the backplane by the individual I/O devices, such as discrete 24V input cards or 0-10V analog cards. Usually there are a limited number of slots available in the backplane and individual slices of control components can be inserted.

Balluff focuses on production-oriented sensor solutions and understands the unique and complex requirements of global automotive production processes. Our sensors have all the required approvals and are specified by most major automotive manufacturers.

Businesses are turning to Distributed Modular I/O for improving their throughput and increasing their flexibility while cutting costs out of their controls design and implementation. By using Distributed Modular I/O, the I/O “slices” are separate from the network communication and are designed for mounting on the machine in small pockets of distributed I/O.

Take a closer look at the process of manual tool management versus automated tool management. An in-depth examination of process improvement methodologies, a case study, and associated ROI calculations offer compelling evidence to justify an upgrade to automated identification systems.

See sensor applications for the automotive industry.