We assist in process security
Sensors from Balluff with their extraordinary design features let you use them directly in a vacuum. For example during alignment on the fly when the wafer is centered in the vacuum lock or when you need to check it for presence.
We offer thread-in versions with a sealing function as well as sensors for installation directly in high vacuum. Their signals are reliably brought out through electrical cables via a cable fitting. And take special note: Since we use outgassing-optimized materials for the sensor, your process remains secure. If requested we can also produce the sensors in materials you specify.
You can reliably ensure alignment of the wafer on-the-fly using two Micromote through-beam sensors. Their high-precision signals make it possible to calculate the offset for the ideal line when the switching for both through-beam sensors is not simultaneous. Due to our Microspot technology, you can correct the wafer, since it precisely detects the sharp wafer edges.
To ensure a reliable process you monitor presence of a wafer or carrier using our outgassing-optimized diffuse sensors. The infrared sensors with external amplifier are suited for use in a vacuum. Their ultra-flat form factor just 1.7 mm high with small vulnerability area are perfect for the limited space in a vacuum chamber.
Our photoelectric sensors with separate electronics use special optics with a small light spot to detect the presence of a wafer or carrier through a viewing aperture. Simply thread the vacuum compatible diffuse sensor with stainless steel housing into your process chamber. The chamber is then sealed and no cable feedthrough is needed.