Our intelligent sensor solutions detect objects reliably. From metals to nonmetals to bulk materials and liquids: Balluff has the right solution for every object and material. Our contact-free technology also operates wear-free and with absolute reliability under rough ambient conditions.
Balluff BCS capacitive sensors and BOH MICROmote sensors reliably monitor stack heights, with various surfaces and also with transparent objects.
Our BES inductive sensors offer efficient solutions for numerous applications. For position detection in linear drives, the BES inductive sensor does not return an absolute position, but detects the change of position by counting pulses. This makes the Balluff sensor solution more cost-effective than, for example, a rotary encoder.
Sensors for detecting color and contrast support the positioning of electrodes in the arc furnace. The sensor, which is protected in the gripper, checks whether it has been gripped correctly using color markings on the electrode – with absolute reliability and at various temperatures.
BUS ultrasonic sensors from Balluff are precision all-rounders. They detect sheets on rolls and coils and regulate the correct material feed on the dancer roll according to the sheet sag. In this way they ensure the correct roller drive and that the sheet tension is always perfect.
Fulfilling your highest quality requirements: the BFS color sensor from Balluff is unrivaled in inspecting sheet and plate finishes. It detects even the slightest color nuances and reliably registers whether a sheet leaves the plant polished or unpolished. Even temperature fluctuations won't keep it from correctly and reliably distinguishing the finished pieces.
You can reliably ensure alignment of the wafer on-the-fly using two Micromote through-beam sensors. Their high-precision signals make it possible to calculate the offset for the ideal line when the switching for both through-beam sensors is not simultaneous. Due to our Microspot technology, you can correct the wafer, since it precisely detects the sharp wafer edges.