Customized BOH photoelectric sensors
Our optoelectronic sensors are true specialists in object detection with a wide range of applications. Our particularly precise, small and very flexibly applicable BOH Micromote system can also be adapted to most individual requirements:
Thanks to the modular system of Micromote sensors, we can meet your specific requirements in various areas:
- Precisely define the light spot
- Adaptation to minimum size
- Individual housing designs
- Flexible adaptation of the cabling
- Design for special environmental conditions, e.g. high vacuum and increased temperature ranges
- Individual amplifiers with high sampling frequency
- Multiplexing of many (up to 30) channels
In many applications our individual solutions have already proven themselves. Here are some examples:
Wafer mapping in demanding installation situations
For wafer mapping, we offer a high-precision sensor that can be perfectly integrated into the end effector of a robot. Specially developed for the sometimes extremely thin end effectors, our mapping sensor has a tightly controlled and focused light spot with outstanding homogeneity. This allows you to detect the edges of the wafers, which are only a few μm thick, extremely precisely, and reliably detect full slots, double wafers or wafers in a skewed position at any time.
The mapping sensor is based on the optoelectronic Micromote technology, which combines its exceptionally small optical sensor head with an external evaluation unit (amplifier) and connects it via a highly flexible cable. Thus, like all Micromote sensors, we can adapt the mapping sensor perfectly to highly demanding mechanical installation situations.
Automated packaging with a modular system
To count tablets and correctly feed them into containers, Balluff provides you with light band sensors from the Micromote family with exceptional precision, flexibility and contamination compensation.
The modular system, consisting of an external evaluation unit and sensor head with transmitter and receiver, can be optimally aligned to your requirements to, for example, adjust the distance and size of the drop gap. In terms of mechanical integration, you have great design freedom thanks to the high degree of miniaturization and possible specifications, by, for example, using a very flexible sensor cable with high flex fatigue strength. By using different types of light and wavelengths, the system can be adapted to a wide variety of applications.
