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Visit Balluff at PACK EXPO Chicago 2024

Experience our latest technologies to boost your overall equipment efficiency

November 3 - 6, 2024

McCormick Place, Chicago, IL

Balluff booth: N-5539

Join Balluff’s packaging, food and beverage industries automation specialists in booth N-5539 to experience the latest automation technology for controls architecture, condition monitoring, guided format change and more to enhance your processes, decrease downtime and improve your overall equipment efficiency. Our demos at the event will include:

  • Guided Changeover Solution

  • Level Detection

  • Form Fill Seal

  • Condition Monitoring

  • Food Safety

  • Smart Automation Monitoring System

  • Network Architecture

  • Traceability with RFID

  • Standard Automation Sensors

  • Logistics

Want to attend PACK EXPO for free?

Click the link below to register for a free floor pass compliments of Balluff.

Get your free floor pass
Where can you find us?

Booth N-5539

See the show floor map
Want more information about PACK EXPO in Chicago?

The exhibitor list, conference schedule and more is on the event home page.

The official website

Energy consumption labeling
Energy consumption labeling

EPREL - European Product Database for Energy Labeling

Do you have any questions or suggestions? We are at your disposal.

For all questions concerning commercial topics such as quotations, orders, and delivery times, our inside sales department will be happy to support you: [email protected]

For Aftersales, Technical Support, Applications and
Product Inquiries we will be happy to support you: [email protected]

Feel free to contact us directly by telephone:

Inside Sales 859-727-2200 - press 1
Presales Tech Support 859-727-2200 - press 2
Aftersales Tech Support 859-727-2200 - press 3


Balluff Inc.

8125 Holton Dr.
Florence, KY 41042

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