Visit us at Interpack 2026
The leading global event for packaging machinery, processing, and automation
Interpack 2026 serves as a premier global event for the packaging industry. From May 7 to 13 in Düsseldorf, Balluff will showcase how advanced automation and sensor technologies can significantly enhance efficiency and reliability in packaging processes.
Guided by the theme “SMARTFICIENCY – Maximum uptime. Smarter packaging performance,” we will showcase at Halle 6, Stand A74 how intelligent sensor technology, vision solutions, industrial networking, and condition monitoring are tackling the core challenges of the packaging industry.:
Fewer downtimes through predictive maintenance
Faster format changes thanks to standardized IO-Link architectures
Higher OEE through transparent real-time data
Error prevention & quality assurance through vision and identification systems
Reliable traceability throughout the entire packaging chain
Our goal: To design packaging processes so that they run more stably, flexibly, and efficiently—whether for individual machines or complete lines.
Our highlights at Interpack 2026:
Request your code for a free trade fair ticket.
We would like to invite you and look forward to seeing you at our booth. You can use the form below to request your code for a free ticket.
Fill in the form and receive your free ticket code
The number of available codes is limited. Only one code per person and e-mail address can be requested. You will receive your individual ticket code by email after submitting the form. If you are not yet registered in our systems, you must first confirm your email address in order to receive the code for a free day ticket. By requesting the free ticket code, you also agree to subscribe to Balluff News.